Every specification, documented.

Full technical specifications for Nova Studio Pro. Select a tier to review available configurations.

Processor

Tier Processor Cores Architecture
Entry Ampere Altra 32 cores Arm Neoverse N1
Creator Ampere Altra Max 128 cores Arm Neoverse N1
Elite Ampere AmpereOne 192 cores Arm Neoverse V1

Memory (MGS)

Tier Capacity Type Availability
M1 Standard 64 GB DDR5 ECC All tiers
M2 Plus 128 GB DDR5 ECC All tiers
M3 Max 256 GB DDR5 ECC All tiers
M4 Ultra Max 512 GB DDR5 ECC Elite only

Graphics (MGS)

Tier GPU VRAM Availability
G1 Standard NVIDIA RTX 5060 8 GB GDDR7 All tiers
G2 Plus NVIDIA RTX 5080 16 GB GDDR7 All tiers
G3 Max Dual NVIDIA RTX 5080 32 GB GDDR7 All tiers
G4 Ultra Max Dual NVIDIA RTX 5090s 64 GB GDDR7 Elite only

Storage (MGS)

Tier Configuration Total Capacity Availability
S1 Standard 1 TB Gen5 NVMe 1 TB All tiers
S2 Plus 4 TB Gen5 NVMe 4 TB All tiers
S3 Max 8 TB Gen5 NVMe + 4×4 TB U.2
Fully populated, pre-configured
24 TB All tiers
S4 Ultra Max 8 TB NVMe + 4×15 TB U.2 + PCIe RAID
Fully populated, pre-configured
68 TB Elite only
All storage tiers ship fully populated and pre-configured. No "empty bay" options.

Connectivity

Interface Specification Count / Details
Thunderbolt Thunderbolt 5 8 total (6 rear + 2 top), USB-C form factor
Wi-Fi Wi-Fi 7 802.11be, tri-band
Bluetooth Bluetooth 5.4 LE Audio support
UWB Ultra-Wideband Spatial awareness, device handoff
USB-C Only Philosophy
  • No HDMI port
  • No USB-A ports
  • No SD card slot
  • No 3.5mm headphone jack

Operating System

OS Nova OS
Base Fedora Linux (Arm-native)
Updates Rolling releases, always current
Security Secure boot, encrypted storage, TPM 2.0
Included Apps Nova Pro Suite (Edit Pro, Audio Suite, Shape 3D/VFX, Pages, Decks)
Compatibility Pro app compatibility layer for industry-standard software

Design & Materials

Enclosure Billet 6061-T6 aluminum
Finish Matte anodized
Motherboards ODM-tweaked P0 + MAGE-1
Cooling Optimized thermal flow, whisper-quiet acoustics
Access Tool-free GPU, storage, and memory upgrades
Origin Assembled in the Emirates. In-country value target: 41% (ICV)
Final validation in progress
  • RAM speed / channels / DIMM layout
  • PCIe lane allocation & expansion slots
  • Native Ethernet ports & speeds
  • Cooling targets (acoustics + thermals)
  • Dimensions & weight
  • Power draw per tier
  • Final pricing for all configurations

Technical Notes

  1. Core counts vary by tier and processor option. Elite tier supports up to 192 cores with Ampere AmpereOne.
  2. Thunderbolt 5 ports support up to 120 Gbps bidirectional bandwidth. Port count and routing may vary by final mainboard revision.
  3. Some specifications are subject to change prior to final production and certification.
  4. In‑Country Value (ICV) is a program target and may vary based on final certification and supply-chain allocation.